Cooler Master High Performance Thermal Paste 2.37g

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ID: 59594 Product code: HTK-002-U1-GP
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Warranty: 2 years (Warranty for business entities 1 year)
Main product parameters All parameters
  • Volume, g: 2.37
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Volume, g 2.37 1.0 2.0 3.0 1.5
All parameters
Volume, g : 2.37
More detailed specification
Category - Root/Electronics/PC parts/Cooling/Thermal pastes
Category_1 - Computer Cases and Cooling
Category_2 - Thermal Materials
Description - Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177 C (350 F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.Features:Suitable for CPU, chipsets on Mainboard, VGA card, etc.Easy to useZif Socket Templates ensure correct applying area with various CPU socket typesProduces an even layer when using applicatorDielectricWide range of application temperature
Designation - CE+WEEE
dimension depth - 20 mm
dimension height - 180 mm
dimension weight - 36 g
dimension width - 10 mm
ean - 4719512002940
Eans - 4719512002940
EAN_code - 4719512002940
guarantee - 24
guarantee_type - normal
Manufacturer - Cooler Master
Manufacturer_code - HTK-002-U1-GP
Name - Cooler Master HTK-002 High Performance
Name - Cooler Master HTK 002
name - Thermal Grease 2.0g
producer - Cooler Master
Producer - CoolerMaster
ProducerCode - HTK-002-U1-GP
ShortDescription - pojemność: 2.0 g | kolor: biały
Technical_details - Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. Content 2 gramme
vendpn - HTK-002-U1-GP
Weight - 0,04
11.43 €
Cooler Master High Performance Thermal Paste 2.37g
Intel technology provider Platinum 2020
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